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图像 型号 现有数量 单价(USD) 工作温度 厂家 封装 PDF资料
TS555IN TS555IN 0 面议 -40°C ~ 125°C STMicroelectronics 8-DIP(0.300",7.62mm)
TS556IN TS556IN 0 面议 -40°C ~ 125°C STMicroelectronics 14-DIP(0.300",7.62mm)
NE555D NE555D 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555CN TS555CN 0 面议 0°C ~ 70°C STMicroelectronics 8-DIP(0.300",7.62mm)
TS555ID TS555ID 0 面议 -40°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555CDT TS555CDT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555CDT TS555CDT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555CDT TS555CDT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555IPT TS555IPT 0 面议 -40°C ~ 125°C STMicroelectronics 8-TSSOP(0.173",4.40mm 宽)
TS555IPT TS555IPT 0 面议 -40°C ~ 125°C STMicroelectronics 8-TSSOP(0.173",4.40mm 宽)
TS555IPT TS555IPT 0 面议 -40°C ~ 125°C STMicroelectronics 8-TSSOP(0.173",4.40mm 宽)
NE556D NE556D 0 面议 0°C ~ 70°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA555D SA555D 0 面议 -40°C ~ 105°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SA556D SA556D 0 面议 -40°C ~ 105°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA556N SA556N 0 面议 -40°C ~ 105°C STMicroelectronics 14-DIP(0.300",7.62mm)
TS555CD TS555CD 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS556CN TS556CN 0 面议 0°C ~ 70°C STMicroelectronics 14-DIP(0.300",7.62mm)
TS556ID TS556ID 0 面议 -40°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SE555DT SE555DT 0 面议 -55°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SE555DT SE555DT 0 面议 -55°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SE555DT SE555DT 0 面议 -55°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SE555N SE555N 0 面议 -55°C ~ 125°C STMicroelectronics 8-DIP(0.300",7.62mm)
M74HC294RM13TR M74HC294RM13TR 0 面议 -55°C ~ 125°C STMicroelectronics 16-SOIC(0.154",3.90mm 宽)
SE555D SE555D 0 面议 -55°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS556CDT TS556CDT 0 面议 0°C ~ 70°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)

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