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深圳市福田区中航路国利大厦2239室
图像 型号 现有数量 单价(USD) 工作温度 厂家 封装 PDF资料
HCF4541BEY HCF4541BEY 0 面议 -55°C ~ 125°C STMicroelectronics 14-DIP(0.300",7.62mm)
HCF4541M013TR HCF4541M013TR 0 面议 -55°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
HCF4541M013TR HCF4541M013TR 0 面议 -55°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
HCF4541M013TR HCF4541M013TR 0 面议 -55°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA556DT SA556DT 0 面议 -40°C ~ 105°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA556DT SA556DT 0 面议 -40°C ~ 105°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA556DT SA556DT 0 面议 -40°C ~ 105°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
SA555DT SA555DT 0 面议 -40°C ~ 105°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SA555DT SA555DT 0 面议 -40°C ~ 105°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
SA555DT SA555DT 0 面议 -40°C ~ 105°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
NE556DT NE556DT 0 面议 0°C ~ 70°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
NE556DT NE556DT 0 面议 0°C ~ 70°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
NE556DT NE556DT 0 面议 0°C ~ 70°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
NE555DT NE555DT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
NE555DT NE555DT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
NE555DT NE555DT 0 面议 0°C ~ 70°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS556IDT TS556IDT 0 面议 -40°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
TS556IDT TS556IDT 0 面议 -40°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
TS556IDT TS556IDT 0 面议 -40°C ~ 125°C STMicroelectronics 14-SOIC(0.154",3.90mm 宽)
TS555IDT TS555IDT 0 面议 -40°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555IDT TS555IDT 0 面议 -40°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
TS555IDT TS555IDT 0 面议 -40°C ~ 125°C STMicroelectronics 8-SOIC(0.154",3.90mm 宽)
NE555N NE555N 0 面议 0°C ~ 70°C STMicroelectronics 8-DIP(0.300",7.62mm)
NE556N NE556N 0 面议 0°C ~ 70°C STMicroelectronics 14-DIP(0.300",7.62mm)
SA555N SA555N 0 面议 -40°C ~ 105°C STMicroelectronics 8-DIP(0.300",7.62mm)

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