图像 |
型号 |
现有数量 |
单价(USD) |
工作温度 |
厂家 |
封装 |
PDF资料 |
|
MC34933EP |
0 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-UFQFN 裸露焊盘 |
|
|
MC34933EPR2 |
0 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-UFQFN 裸露焊盘 |
|
|
MPC17511EPR2 |
0 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
24-VFQFN 裸露焊盘 |
|
|
MPC17531ATEP |
0 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
24-VFQFN 裸露焊盘 |
|
|
MPC17531ATEPR2 |
0 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
24-VFQFN 裸露焊盘 |
|
|
MC33931EKR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33931EK |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC34GD3000EPR2 |
0 |
面议 |
-20°C ~ 105°C(TA) |
Freescale Semiconductor - NXP |
56-VFQFN 裸露焊盘 |
|
|
MC33GD3000EPR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
56-VFQFN 裸露焊盘 |
|
|
MC34937APEK |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC34937APEKR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33937APEKR2 |
0 |
面议 |
-40°C ~ 135°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33937APEK |
0 |
面议 |
-40°C ~ 135°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33887PFK |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
36-PowerQFN |
|
|
MC33887PFKR2 |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
36-PowerQFN |
|
|
MC33932EKR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33932EK |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33887PEK |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33887PEKR2 |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
54-SSOP(0.295",7.50mm 宽)裸焊盘 |
|
|
MC33899VWR2 |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
30-BSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33899VW |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
30-BSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33931VWR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
44-BSSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33932VWR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
44-BSSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33486DH |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33886DH |
0 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|