图像 |
型号 |
现有数量 |
单价(USD) |
工作温度 |
厂家 |
封装 |
PDF资料 |
|
MC144111DWR2 |
0 |
面议 |
0°C ~ 85°C |
Freescale Semiconductor - NXP |
16-SOIC(0.295",7.50mm 宽) |
|
|
FSA95601AH |
0 |
面议 |
* |
Freescale Semiconductor - NXP |
- |
|
|
FSA95601AHR2 |
0 |
面议 |
* |
Freescale Semiconductor - NXP |
- |
|
|
FSA95601VAH |
0 |
面议 |
* |
Freescale Semiconductor - NXP |
- |
|
|
FSA95601VAHR2 |
0 |
面议 |
* |
Freescale Semiconductor - NXP |
- |
|
|
MPC17C724EPR2 |
2500 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-VFQFN 裸露焊盘 |
|
|
MPC17C724EPR2 |
4902 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-VFQFN 裸露焊盘 |
|
|
MPC17C724EPR2 |
4902 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-VFQFN 裸露焊盘 |
|
|
MC33887APVWR2 |
3750 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33887APVWR2 |
4018 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33887APVWR2 |
4018 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33886PVW |
1099 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33931VW |
415 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
44-BSSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33932VW |
211 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
44-BSSOP(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33886PVWR2 |
750 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33886PVWR2 |
760 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33886PVWR2 |
760 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MC33887APVW |
992 |
面议 |
-40°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
20-SOIC(0.433",11.00mm 宽)裸焊盘 |
|
|
MPC17C724EP |
46946 |
面议 |
-20°C ~ 150°C(TJ) |
Freescale Semiconductor - NXP |
16-VFQFN 裸露焊盘 |
|
|
MC34GD3000EP |
195 |
面议 |
-20°C ~ 105°C(TA) |
Freescale Semiconductor - NXP |
56-VFQFN 裸露焊盘 |
|
|
MC33GD3000EP |
260 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
56-VFQFN 裸露焊盘 |
|
|
MC33926PNBR2 |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-PowerQFN |
|
|
MC33926PNBR2 |
2307 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-PowerQFN |
|
|
MC33926PNBR2 |
2307 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-PowerQFN |
|
|
MC33926PNB |
0 |
面议 |
-40°C ~ 125°C(TA) |
Freescale Semiconductor - NXP |
32-PowerQFN |
|