图像 | 型号 | 现有数量 | 单价(USD) | 工作温度 | 厂家 | 封装 | PDF资料 |
---|---|---|---|---|---|---|---|
PEF 22628 E V1.2-G | 0 | 面议 | -40°C ~ 85°C | Infineon Technologies | 324-LBGA | ||
PEF 24624 E V2.2-G | 0 | 面议 | -40°C ~ 85°C | Infineon Technologies | 324-LBGA | ||
PEF 24628 E V1.2-G | 0 | 面议 | -40°C ~ 85°C | Infineon Technologies | 324-LBGA | ||
PEF 3314 E V2.2-G | 0 | 面议 | -40°C ~ 85°C | Infineon Technologies | 176-LBGA | ||
PSB 21553 E V1.4-G | 0 | 面议 | - | Infineon Technologies | 324-LBGA | ||
PSB 21653 EL V1.5-G | 0 | 面议 | - | Infineon Technologies | 324-LBGA | ||
PSB 6970 HL V1.3 | 0 | 面议 | - | Infineon Technologies | 100-LQFP | ||
PSB 6972 HL V1.3 | 0 | 面议 | - | Infineon Technologies | 100-LQFP | ||
PSB 6973 EL V1.3-G | 0 | 面议 | - | Infineon Technologies | 225-LFBGA | ||
PSF 6973 EL V1.3-G | 0 | 面议 | - | Infineon Technologies | 225-LFBGA | ||
TCA505BG GEG | 2500 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BG GEG | 3850 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BG GEG | 3850 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BGGEGXUMA1 | 0 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BGGEGXUMA1 | 87 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BGGEGXUMA1 | 87 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TCA505BG | 0 | 面议 | -40°C ~ 110°C | Infineon Technologies | 16-SOIC(0.154",3.90mm 宽) | ||
TLE6212XUMA1 | 0 | 面议 | - | Infineon Technologies | 64-LQFP | ||
TLE9260QXV33XUMA1 | 0 | 面议 | Infineon Technologies | ||||
TLE9260QXXUMA2 | 0 | 面议 | Infineon Technologies | ||||
TLE9261QXV33XUMA1 | 0 | 面议 | Infineon Technologies | ||||
TLE9261QXXUMA2 | 0 | 面议 | Infineon Technologies | ||||
TLE92603QXV33XUMA1 | 0 | 面议 | Infineon Technologies | ||||
TLE92603QXXUMA2 | 0 | 面议 | Infineon Technologies | ||||
TLE9262QXV33XUMA1 | 0 | 面议 | Infineon Technologies |