图像 |
型号 |
现有数量 |
单价(USD) |
工作温度 |
厂家 |
封装 |
PDF资料 |
|
TLE4270-2D |
16519 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
TLE4267G |
3000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE4267G |
3477 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE4267G |
3477 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE4270-2G |
2000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-6,D2Pak(5 引线+接片),TO-263BA |
|
|
TLE4270-2G |
2395 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-6,D2Pak(5 引线+接片),TO-263BA |
|
|
TLE4270-2G |
2395 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-6,D2Pak(5 引线+接片),TO-263BA |
|
|
TLE4271-2G |
2000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE4271-2G |
2517 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE4271-2G |
2517 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-263-8,D2Pak(7 引线+接片),TO-263CA |
|
|
TLE42962GV33HTSA1 |
3000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
6-SMD(5 个接脚),鸥形翼 |
|
|
TLE42962GV33HTSA1 |
3402 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
6-SMD(5 个接脚),鸥形翼 |
|
|
TLE42962GV33HTSA1 |
3402 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
6-SMD(5 个接脚),鸥形翼 |
|
|
IFX24401TE V50 |
2500 |
面议 |
-40°C ~ 125°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
IFX24401TE V50 |
2990 |
面议 |
-40°C ~ 125°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
IFX24401TE V50 |
2990 |
面议 |
-40°C ~ 125°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
TLS805B1SJVXUMA1 |
5000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLS805B1SJVXUMA1 |
5000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLS805B1SJVXUMA1 |
5000 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLE4254EJAXUMA1 |
2500 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLE4254EJAXUMA1 |
4999 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLE4254EJAXUMA1 |
4999 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
8-SOIC(0.154",3.90mm 宽)裸焊盘 |
|
|
TLE42754DATMA1 |
0 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
TLE42754DATMA1 |
1637 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|
|
TLE42754DATMA1 |
1637 |
面议 |
-40°C ~ 150°C |
Infineon Technologies |
TO-252-5,DPak(4 引线 + 接片),TO-252AD |
|