| 图像 |
型号 |
现有数量 |
单价(USD) |
工作温度 |
厂家 |
封装 |
PDF资料 |
 |
SA57000-30D,115 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
SC-74A，SOT-753 |
 |
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NXQ1TXH5/101J |
0 |
面议 |
-20°C ~ 85°C |
NXP Semiconductors |
32-VFQFN 裸露焊盘 |
|
|
NXQ1TXH5/101J |
353 |
面议 |
-20°C ~ 85°C |
NXP Semiconductors |
32-VFQFN 裸露焊盘 |
|
|
NXQ1TXH5/101J |
353 |
面议 |
-20°C ~ 85°C |
NXP Semiconductors |
32-VFQFN 裸露焊盘 |
|
 |
NXQ1TXA5/505J |
0 |
面议 |
-20°C ~ 85°C |
NXP Semiconductors |
32-VFQFN 裸露焊盘 |
|
 |
TDA3681J/N2S,112 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
17-SIP 成形引线 |
|
|
TDA3681JR/N2S |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
17-SIP 成形引线 |
|
 |
TDA3681TH/N2S,518 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.433"，11.00mm 宽）裸焊盘 |
|
|
TDA3681ATH/N1S,518 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.433"，11.00mm 宽）裸焊盘 |
|
 |
TDA3683J/N2S,112 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
23-SIP 成形引线 |
|
 |
NE57814DD,518 |
0 |
面议 |
0°C ~ 70°C |
NXP Semiconductors |
8-SOIC（0.154"，3.90mm 宽）裸焊盘 |
|
|
NE57814DD,518 |
0 |
面议 |
0°C ~ 70°C |
NXP Semiconductors |
8-SOIC（0.154"，3.90mm 宽）裸焊盘 |
|
|
NE57814DD,518 |
0 |
面议 |
0°C ~ 70°C |
NXP Semiconductors |
8-SOIC（0.154"，3.90mm 宽）裸焊盘 |
|
 |
SA5778D/CE1804,512 |
0 |
面议 |
-40°C ~ 105°C |
NXP Semiconductors |
28-SOIC（0.295"，7.50mm 宽） |
|
|
SA5778D/CE1804,518 |
0 |
面议 |
-40°C ~ 105°C |
NXP Semiconductors |
28-SOIC（0.295"，7.50mm 宽） |
|
|
SA5778D,518 |
0 |
面议 |
-40°C ~ 105°C |
NXP Semiconductors |
28-SOIC（0.295"，7.50mm 宽） |
|
|
SA5778D,512 |
0 |
面议 |
-40°C ~ 105°C |
NXP Semiconductors |
28-SOIC（0.295"，7.50mm 宽） |
|
 |
TDA3606AT/N1,112 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.295"，7.50mm 宽） |
|
|
TDA3606AT/N1,118 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.295"，7.50mm 宽） |
|
 |
TDA3606T/N1,112 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
8-SOIC（0.154"，3.90mm 宽） |
|
|
TDA3606T/N1,118 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
8-SOIC（0.154"，3.90mm 宽） |
|
 |
TDA3608Q/N3C,112 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
13-SIP 成形引线 |
|
|
TDA3608TH/N3C,512 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.433"，11.00mm 宽）裸焊盘 |
|
|
TDA3608TH/N3C,518 |
0 |
面议 |
-40°C ~ 85°C |
NXP Semiconductors |
20-SOIC（0.433"，11.00mm 宽）裸焊盘 |
|
 |
TDA3616SF/N1,112 |
0 |
面议 |
-40°C ~ 105°C |
NXP Semiconductors |
9-SIP 裸露接片 |
|
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